BSP는 최신 IT 응용기기 제작에 필요한 레이저 기술을 독자적으로 보유하고 있습니다.
특화된 Laser 및 Etching 기술을 바탕으로, 디스플레이, 반도체, Micro/Mini-LED, PCB, 솔라셀, 배터리 등의 다양한 산업분야에 적용 가능한 장비와 재료를 공급하고 있습니다.
Laser Solution
Manufacturing EquipmentBusiness Consulting and Technical Consulting
UTG & TGV
- UTG(Foldable Phone)
- GMF(Foldable Phone)
- TGV (Semiconductor Package/ MEMS/ Sensor / Optical Component)
Mini & Micro LED
- Laser Bonding
- Selective LLO & Bonding
- Rework / Repair
- High Speed Mass Transfer
- BLU Bonding
Semiconductor
- Memory Device Annealing
- EUV Mask ML Annealing
- EUV Mask PR Baking
- DUV Mask Glue Cleaning
- Interposer(TGV)
OLED
- LLO(Laser Lift-Off)
- Laser Singulation Flexible Cutting
- Laser Module Cutting
- Laser Repair System
IPL Solution
FCCL & Printed Electronics
- Copper & Ag
- IPL & Laser System
- Processing
※ UTG: Ultra Thin Glass, GMF: Glass Mid-Frame, TGV: Through Glass Via
Material
Optical Component & Carrier
- Optical Components for Camera Module
- Carrier for Semiconductor
Customized Chemical
- HF based Specialized Chemical for LMCE
- H2SO4 based Specialized Chemical for LMCE
- NH4F based Specialized Chemical for LMCE
- High Speed Mass Transfer
- F2H5N based Specialized Chemical for LMCE
Copper Materials
- Copper Nano Particles from 30 nm to 8 um Size
- Conductive Copper Ink & paste
Processing
Processing Royalty
- Ultra Thin Glass by LMCE
- Glass Mid Frame by LMCE
- Through Glass Via by LMCE
※ LMCE : Laser Modification Chemical Etching