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사업영역

BSP는 최신 IT 응용기기 제작에 필요한 레이저 기술을 독자적으로 보유하고 있습니다.

특화된 Laser 및 Etching 기술을 바탕으로, 디스플레이, 반도체, Micro/Mini-LED, PCB, 솔라셀, 배터리 등의 다양한 산업분야에 적용 가능한 장비와 재료를 공급하고 있습니다.

Laser Solution

Manufacturing EquipmentBusiness Consulting and Technical Consulting

UTG & TGV

  • UTG(Foldable Phone)
  • GMF(Foldable Phone)
  • TGV (Semiconductor Package/ MEMS/ Sensor / Optical Component)

Mini & Micro LED

  • Laser Bonding
  • Selective LLO & Bonding
  • Rework / Repair
  • High Speed Mass Transfer
  • BLU Bonding

Semiconductor

  • Memory Device Annealing
  • EUV Mask ML Annealing
  • EUV Mask PR Baking
  • DUV Mask Glue Cleaning
  • Interposer(TGV)

OLED

  • LLO(Laser Lift-Off)
  • Laser Singulation Flexible Cutting
  • Laser Module Cutting
  • Laser Repair System

IPL Solution

FCCL & Printed Electronics

  • Copper & Ag
  • IPL & Laser System
  • Processing

※ UTG: Ultra Thin Glass, GMF: Glass Mid-Frame, TGV: Through Glass Via

Material

Optical Component & Carrier

  • Optical Components for Camera Module
  • Carrier for Semiconductor

Customized Chemical

  • HF based Specialized Chemical for LMCE
  • H2SO4 based Specialized Chemical for LMCE
  • NH4F based Specialized Chemical for LMCE
  • High Speed Mass Transfer
  • F2H5N based Specialized Chemical for LMCE

Copper Materials

  • Copper Nano Particles from 30 nm to 8 um Size
  • Conductive Copper Ink & paste

Processing

Processing Royalty

  • Ultra Thin Glass by LMCE
  • Glass Mid Frame by LMCE
  • Through Glass Via by LMCE

※ LMCE : Laser Modification Chemical Etching

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